Microscope image of electromigration-induced hillock and void

High magnification SEM micrograph of the notch area after

PDF) In-situ scanning electron microscope observation of electromigration-induced void growth in 30 nm ½ pitch Cu interconnect structures

Mitigation of Electromigration in Metal Interconnects via Hexagonal Boron Nitride as an Ångström‐Thin Passivation Layer - Jeong - 2021 - Advanced Electronic Materials - Wiley Online Library

In-Situ Observation and Quantitative Analysis of Electromigration Void Dynamics

Electromigration Reliability of Barrierless Ruthenium and Molybdenum for Sub-10 nm Interconnection

Mitigation of Electromigration in Metal Interconnects via Hexagonal Boron Nitride as an Ångström‐Thin Passivation Layer - Jeong - 2021 - Advanced Electronic Materials - Wiley Online Library

Micromachines, Free Full-Text

PDF) Hillock formation during electromigration in Cu and Al thin films: Three‐dimensional grain growth

Materials Quest for Advanced Interconnect Metallization in Integrated Circuits - Moon - 2023 - Advanced Science - Wiley Online Library

Microscope image of electromigration-induced hillock and void

Microscope image of electromigration-induced hillock and void

Effects of an interfacial layer on stress relaxation mechanisms active in the Cu–Si thin film system during thermal cycling, MRS Communications

PDF) Hillock formation during electromigration in Cu and Al thin films: Three‐dimensional grain growth

Thermal Stress Characteristics and Stress-Induced Void Formation in Aluminum and Copper Interconnects (Chapter 3) - Electromigration in Metals